An all-star group of leaders on a mission to innovate
A hand-picked all-star team of innovators is driving applied research to real solutions that make a difference. Supported by the Governor of Indiana, presidents of top research universities, along with military and industry leaders, the Indiana Innovation Institute pushes the pace of innovation.
A trim and agile structure speeds technology development
Get your innovation to the end user while it’s still innovative. We bring government, industry and academia to the same table for you. Our streamlined process allows a fast, flexible, financially feasible approach.
A connection to top laboratories, equipment, research facilities and star talent
Getting VIP access to billions of dollars in operational assets connects you to award winning researchers and star talent working hard to get you a product or solution that impacts people’s lives.
Developing trusted microelectronics that are counterfeit resistant and immune to a wide variety of attacks. These trusted microelectronics have applications in virtually all military products and drive a $189 billion commercial industry for products you use every day.
IN3 and the NavalX Midwest Tech Bridge conducted their first Tech Demonstration. Ten Indiana companies and one university had the opportunity to exhibit and explain their innovative products and abilities to representatives from NSWC Crane and other U.S. Navy officials.
The Indiana Innovation Institute (IN3) is once again expanding its team. Joining the organization is Bill Breedlove, vice president of federal capture engagement, and Richard (Rich) Leonard, who is the director of federal capture.
NSWC Crane’s Midwest Tech Bridge and the Indiana Innovation Institute announce agreement to accelerate technology to the warfighter
NavalX Midwest Tech Bridge has awarded its first Collaborative Project Order to the Indiana Innovation Institute (IN3) to foster collaboration among universities, industry, small businesses and non-profits to accelerate technology to the warfighter in areas including trusted microelectronics, hypersonics, and electro-optics.